Thermal Performance Enhancement Of Phase Change Material (PCM)-Based Heat Sinks Using Cuo Nanoparticle Additives: A Simulation Study
DOI:
https://doi.org/10.64252/xg87qk24Keywords:
PCM heat sink; Nanoparticle-enhanced PCM; CuO; Thermal conductivity; ANSYS Fluent; Oblique fins; Electronics cooling; Transient heating; Energy storage; Phase change simulation.Abstract
Phase change materials (PCMs) have attracted attention for passive thermal control in electronics because they can absorb and release large amounts of heat while staying close to a constant temperature. Yet their low thermal conductivity remains a sticking point. Heat does not spread efficiently, and under transient loading, the material often cannot keep up with the demands of compact devices. To explore ways around this, we carried out a numerical study of a PCM-based heat sink using ANSYS Fluent with the enthalpy–porosity method. The geometry chosen was a Model-5 cavity with oblique fins, filled either with pure RT60 paraffin or with RT60 modified by adding CuO nanoparticles at loadings between 0.5 and 2.0 wt%.
The simulations point to a clear, if modest, benefit from the nanoparticles. During the charging phase under a 5 kW·m⁻² heat flux, the enhanced PCM spread heat laterally more effectively and reduced the formation of hot spots around the fin tips. By the end of this phase, cases with 1.0–2.0 wt% CuO showed peak temperatures about 2–4 K lower than the baseline, while the total melting time remained largely unchanged since latent heat still dictated the process. In the discharging stage, the nanoparticle blends cooled more quickly, cutting the solidification period by roughly 6–10%. Although latent heat capacity dropped slightly (by less than 3%), the gain in conductivity compensated for this loss, producing a net improvement in thermal behavior.
Taken together, these outcomes suggest that small amounts of CuO can provide a useful supplement to fin-based designs. The nanoparticles help trim peak operating temperatures and shorten cooldown times, offering a practical margin of safety for electronics exposed to repetitive heating. When combined with structural modifications or external convection aids, such composites appear to be a viable option for designing compact, thermally stable systems.
