Enhanced Thermal Management of Polymer Composites Using Nanostructured Fillers

Abstract

Polymer materials exhibit temperature-dependent molecular motion, which influences their thermal response and mechanical properties. Effective thermal management is essential for advanced microelectronic packaging materials to dissipate heat generated during device operation. This study explores the enhancement of thermal conductivity in polymer matrix composites through the integration of nanostructured fillers. A combination of graphene nanoplatelets (GNPs), carbon nanotubes (CNTs), hexagonal boron nitride (h-BN), and silver nanoparticles (AgNPs) was utilized to improve heat dissipation. Surface functionalization of fillers with silane coupling agents facilitated superior interfacial adhesion, reducing thermal resistance within the composite matrix. The experimental analysis was conducted using the laser flash method for thermal diffusivity measurement and differential scanning calorimetry (DSC) for heat capacity evaluation. Results indicate that the hybrid nanofiller system significantly enhances thermal conductivity while maintaining a low coefficient of thermal expansion (CTE), ensuring dimensional stability in high-temperature applications.